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 Advance Product Information
January 12, 2004
Ku-Band VSAT Packaged Amplifier
* * * * * * *
Top View Bottom View
TGA2508-EPU-SM
Key Features
Typical Frequency Range: 12 - 19 GHz 25 dB Nominal Gain 29 dBm Nominal P1dB Bias Conditions: 7 V, 433 mA PHEMT Technology Low cost true surface mount package Package Dimensions: 4.0 x 4.0 x 0.9 mm (0.157 x 0.157 x 0.035 in)
Preliminary Measured Data
Bias Conditions: Vd = 7 V, Id = 433 mA 30 20 S-Parameter (dB) 10 0 -10 -20 -30 -40 10 11 12 13 14 15
Primary Applications
* * VSAT Ground Terminals Point to Point Radio Military Ku Band Ku-Band Space
GAIN ORL
* *
IRL
16
17
18
19
20
Frequency (GHz)
35 30 P1dB (dBm) 25 20 15 10 12 13 14 15 16 17 18 19 Frequency (GHz)
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
1
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
January 12, 2004
TGA2508-EPU-SM
TABLE I MAXIMUM RATINGS 5/ SYMBOL
V
+ -
PARAMETER
Positive Supply Voltage Negative Supply Voltage Range Positive Supply Current (Quiescent) Gate Supply Current Input Continuous Wave Power Power Dissipation Operating Channel Temperature Mounting Temperature (30 Seconds) Storage Temperature Package Operating Temperature
VALUE
8V -2 to 0 V 591 mA 16 mA 17 dBm 4.7 W 150 C 250 C -65 to 150 C -40 to 110 C
0 0 0 0
NOTES
4/
V I
+
4/
| IG | PIN PD T CH TM TSTG T CASE
3/ 4/ 1/ 2/
1/ 2/
These ratings apply to each individual FET. Junction operating temperature will directly affect the device median time to failure (T M). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. When operated at this bias condition with a base plate temperature of 70 C, the median life is 4.3E+6 hrs.
0
3/
4/ 5/
Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. These ratings represent the maximum operable values for this device.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
2
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
January 12, 2004
TGA2508-EPU-SM
TABLE II ELECTRICAL CHARACTERISTICS (Ta = 25oC 5oC)
PARAMETER Frequency Range Drain Operating Quiescent Current Small Signal Gain Input Return Loss (Linear Small Signal) Output Return Loss (Linear Small Signal Output Power @ 1 dB Compression Gain TYPICAL 12 - 19 7 433 25 15 7 29 UNITS GHz V mA dB dB dB dBm
TABLE III THERMAL INFORMATION
PARAMETER TEST CONDITIONS Vd = 7 V ID = 433 mA Pdiss = 3.031 W TCH O ( C) RTJC (qC/W) TM (HRS)
RJC Thermal Resistance (Channel to Case)
111
13.5
3.8 E+7
Note: Worst case condition with no RF applied, 100% of DC power is dissipated, Case O Temperature @ 70 C
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
3
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
January 12, 2004
TGA2508-EPU-SM
Preliminary Measured Data
Bias Conditions: Vd = 5 - 7 V, Id = 433 mA
32 30 28 26 24 Gain (dB) 22 20 18 16 14 12 10 10 11 12 13 14 15 16 17 18 19 20 Frequency (GHz)
5V 6V 7V
32 31 30 29 P1dB (dBm) 28 27 26 25 24 23 22 12 13 14 15 16 17 18 19 Frequency (GHz)
7V 6V 5V
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
4
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
January 12, 2004
TGA2508-EPU-SM
Preliminary Measured Data
Bias Conditions: Vd = 5 - 7 V, Id = 433 mA
0 -5 -10 Input Return Loss (dB) -15
6V
5V
-20 -25 -30 -35 -40 10 11 12 13 14 15 16 17 18 19 20 Frequency (GHz)
0 -5 -10
7V
7V
6V
Output Return Loss (dB)
-15 -20 -25 -30
5V
-35 -40 10 11 12 13 14 15 16 17 18 19 20 Frequency (GHz)
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
5
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
January 12, 2004
TGA2508-EPU-SM
Preliminary Measured Data
Bias Conditions: Vd = 5 - 7 V, Id = 433 mA
32 31
7V
30 29 Psat (dBm) 28 27 26 25 24 23 22 12 13 14 15 16 17 18 19 Frequency (GHz)
6V 5V
32 30 28 26 24 Pout (dBm) 22 20 18 16 14 12 10 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 Pin (dBm)
1.4
Frequency @ 14 GHz
Vd=5V Vd=6V Vd=7V
1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 Current (A)
6
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
January 12, 2004
TGA2508-EPU-SM
Package Layout
Top View
Bottom View
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
7
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
January 12, 2004
TGA2508-EPU-SM
Package Pinout Diagram
10 11 12
9 TGA 2508-SM
1
8
13
2
7
3
6
5
4
Top Side
Dot indicates Pin 1
Bottom Side
Pin
1 2 3 4 5-7 8 9 10 11, 12 13
Description
NC RF Input NC Vg NC RF Output NC Vd NC GND
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
8
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
January 12, 2004
TGA2508-EPU-SM
Mechanical Drawing
(Bottom Side)
10
11
12
9 13 8
2.41 x 2.41mm Die Attach Pad
1
2
7
3
6
5
4
Thickness
Units: Millimeters Package tolerance: +/- 0.10
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
9
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
January 12, 2004
TGA2508-EPU-SM
Recommended Board Layout Assembly
Vd
1uF
100PF
RFin
RFout
100PF
1uF
Vg
All measurement was made with part solder to 0.008 in thick of RO4003
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice
10
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com


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